Highcon to Showcase Latest Digital Die Cutting Systems at SuperCorrExpo 2024 on Sun Automation Booth

Highcon, a leading provider of digital die cutting and creasing systems, will showcase its latest innovations for mainstream corrugated packaging and display production at SuperCorrExpo 2024. Attendees can experience innovative packaging and displays produced on the upgraded Highcon Beam 2C and the Highcon Beam Writer at the Sun Automation Group booth, 1731, from September 8-12 at the Orange County Convention Center. Sun Automation is Highcon’s go-to-market partner in the US.

First introduced ahead of drupa in April 2024, Highcon’s new corrugated solutions, are designed to meet the evolving needs of the corrugated industry. These solutions offer a non-crush process, customizable packaging for rightsizing and light-weighting, and strength for shipping products in their boxes. They also enhance the unboxing experience, supporting brand owners. Highlights include e-commerce shipper boxes with single-use tamper evident locks, mono material inserts, and intricate cuts.

Both independent and integrated corrugated converters are utilizing Highcon technology to speed up time to market, increase profits, and enhance efficiency and sustainability. The most recent sale for corrugated packaging and display is to Durham Box in the UK, which has invested in the upgraded Highcon Beam 2C to boost productivity and efficiency across its operations, particularly in the e-commerce sector.

“The enthusiastic response from industry leaders to our advanced solutions highlights our commitment to meeting critical market needs for agility, on-demand manufacturing capabilities, sustainability, and innovation. We are excited to lead the market in digital die cutting for corrugated packaging and display, driving growth, and boosting profit margins,” said Kevin Kesselring, Director of Sales Americas. “I look forward to meeting attendees at SuperCorrExpo to explore how our new solutions can help them increase profits and achieve substantial growth and efficiency.”

For more information about Highcon’s innovative digital die cutting solutions, visit the Sun Automation Group Booth 1731 at SuperCorrExpo 2024.

About Highcon

Highcon develops, markets, sells, and supports a portfolio of digital cutting and creasing systems that cover a wide range of formats, substrates, and applications. The Highcon technology is transforming the industry, by providing cost effective solutions to the increasing manufacturing inefficiencies facing folding carton and corrugated carton manufacturers as the result of the emerging market trends of e-commerce, shorter time to market, lower job sizes and a drive to sustainability. Such requirements cannot be accommodated by the expensive and slow conventional die-making and setup process. The Highcon digital technology bridges the gap between agile production and design flexibility delivering improved responsiveness, JIT production, short runs, customization of structure and design, and the ability to perform a wide range of applications in-house. Highcon products are installed at customer sites around the world, including some multi-national companies, effectively supporting the needs of global and local brands. Highcon is publicly traded in the Tel Aviv Stock Exchange (HICN) and its leading investors are Landa Ventures owned by Benny Landa and JVP led by Erel Margalit. For more details: www.highcon.net