Emerson to showcase Floor to Cloud™ packaging solutions at PACK EXPO 2023 (Booth SL-6107)

Global technology, software and engineering leader Emerson will exhibit its Floor to Cloud™ packaging solutions at PACK EXPO Las Vegas, September 11-13, 2023. As the future of automation, Floor to Cloud solutions empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.

Visitors to South Lower Hall, Booth 6107, can view highlights from the comprehensive Floor to Cloud portfolio, which includes AVENTICS™, Branson™, Movicon™, PACEdge and PACSystems™ solutions. Packaging automation experts will demonstrate how a Floor to Cloud approach unlocks trapped data and connects islands of automation, giving manufacturers the visibility and control to solve critical challenges and ambitious goals. Attendees will learn how to improve overall equipment effectiveness (OEE), increase energy efficiency while reducing waste, and create safer operations and digital record keeping.

Emerson will also be highlighted as an industry expert in the new Sustainability Central presented by PMMI and curated by Fuseneo. Located in North Hall (Booth N-9455), Sustainability Central is an interactive experience that demonstrates how manufacturers can achieve packaging sustainability.

Presentation and event highlights:

In addition to showcasing its advanced Floor to Cloud packaging automation solutions, Emerson will also sponsor two events, the annual Packaging & Processing Women’s Leadership Network (PPWLN) breakfast and the Amazing Packaging Race.

All women who are registered for PACK EXPO Las Vegas are invited to the free PPWLN breakfast and program on Tuesday, September 12, at 7:30 a.m. in Room N-247. Following the breakfast, attendees will have the opportunity for a private show floor tour and participate in a Q&A with Lisa Propati, Vice President and General Manager of Weiler Labeling Systems, as well as other packaging executives.

As part of the Amazing Packaging Race, teams from U.S. colleges, trade schools and universities race to complete tasks and solve problems at booths across the PACK EXPO Las Vegas show floor.

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