ACG Capsules Introduces ACGcaps™ H+ Capsules

ACG Capsules (ACGC) announced it has introduced a new line of HPMC capsules meeting a variety of pharmaceutical and nutraceutical needs. The new ACGcaps H+ capsule with no gelling agent is suitable for hygroscopic and moisture-sensitive formulations. It also meets consumer demands for clean label and vegetarian capsule options.

ACGcaps H+ Capsule complies with requirements of dissolution performance across all biological pH range, since it is pH-independent and non-ionic. These capsules also reduce cross-linking problems.

ACGcaps H+ capsules are suitable for filling granules, powders, pellets for prescription and non-prescription pharmaceutical ingredients, nutraceutical dietary supplements and traditional medicines.

“The new and enhanced range of HPMC capsules is designed to give pharma and nutraceutical customers added peace of mind by providing product protection and desired formulation release. The new line contains no gelatin, wheat, gluten, animal by-products or starch, making it ideal for supporting clean label claims and vegetarian diets,” said Selwyn Noronha, CEO for ACG Capsules.

For more information, visit www.acg-world.com.

Share on Socials!

Related Articles

Related Articles

Baralan Introduces New Marina Line of Glass Bottles for Makeup and Skincare Products

Baralan’s new Marina Series expands their glass bottle offerings with a unique, squared silhouette, available in two sizes.  Baralan is a consolidated player in primary packaging ...
Read More

Sonoco ThermoSafe Launches EOS™ Line of Curbside Recyclable Temperature Controlled Parcel Shippers

Sonoco ThermoSafe, a unit of Sonoco and a global provider of temperature assurance packaging for life sciences and healthcare, announced the launch of its new EOS™ ...
Read More

Sandvik Launches an Innovative Smart Packaging Solution

Part of Sandvik Group’s machining solutions division, Sandvik Coromant, is launching an optimized packaging solution to level up its operational sustainability. Developed by R&D engineer and ...
Read More